PackExpo 2021

Sustainable all-cardboard blister pack

Heilbronn, Germany, August 5, 2021 – At PackExpo Las Vegas, Nevada USA, from September 27 to 29, ILLIG will be demonstrating the production of sustainable, all-cardboard blisters from recycled materials with different designs and contents on a single packaging system.

Because less is more: reduce – reuse – separate – recycle – renew.

At booth 5963 in the South Lower Hall at the Las Vegas Convention Center, ILLIG will be presenting the latest packaging system of the HSU 35b series. The system is suitable for safe and sustainable blister packaging made of cardboard-plastic cardboard combinations (double card blister) or solid cardboard for non-food products. The economical and efficient HSU 35b is designed for variable blister heights and can be configured with 3, 6, 8, 10, or 12 transport pallets for any application. The compact machine adapts to the individual requirements of packaging manufacturers with numerous equipment features. Examples include automatic product feeding, product presence control, product inlay, inserts for brochures, marking systems, code readers, and blister lifters. ILLIG packaging systems are modular, flexible, and efficient, allowing brand owners and co-packers the freedom to design sustainable packaging for a variety of end markets.

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ILLIG是全球领先的热成型和包装系统以及纸板、纸张和塑料模具系统的供应商。该公司的产品和服务组合包括复杂生产线和组件的开发、设计、制造、安装和调试。凭借其独特的包装开发方式“Pacivity®360”,ILLIG为其客户提供资源友好型和可持续的解决方案。通过其子公司和销售机构,ILLIG活跃于世界各地的所有市场。75年来,这家家族企业作为可靠的合作伙伴,一直以质量卓越的创新技术和全面的全球服务能力为客户提供高性价比的复杂精密包装和零件制造服务。
注:标有®的是ILLIG Maschinenbau GmbH&Co.KG注册和受保护的商标
 

Further Information更多信息:

江雨墨 市场专员

Anna Jiang, Marketing Specialist
电话:+86 189 6730 3361
邮箱:Anna. Jiang@illigchina.com


海宁伊利格机械设备有限公司
地址:浙江省海宁市海宁大道8号科技绿洲8号楼2楼
邮编:314400

www.illig.com

 

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